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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC33889BPEG |
| Description | INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; |
| Datasheet | MC33889BPEG Datasheet |
| In Stock | 3,458 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 13.5 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.65 mm |
| Sub-Category: | Network Interfaces |
| Surface Mount: | YES |
| Maximum Supply Current: | .045 mA |
| Terminal Finish: | TIN |
| No. of Terminals: | 28 |
| No. of Transceivers: | 1 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| Data Rate: | .125 Mbps |
| JESD-30 Code: | R-PDSO-G28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | SOP |
| Width: | 7.5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Telecom IC Type: | INTERFACE CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP28,.4 |
| Length: | 17.925 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 5.5/18 |
