NXP Semiconductors - MC33MR2001RVKR2

MC33MR2001RVKR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC33MR2001RVKR2
Description TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 85; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet MC33MR2001RVKR2 Datasheet
In Stock4,548
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 40
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: 1.02 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 85
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Length: 6 mm
JESD-30 Code: S-PBGA-B85
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 260
Package Code: TFBGA
Width: 6 mm
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
Moisture Sensitivity Level (MSL): 3
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