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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC33SB0401ES |
| Description | INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40; |
| Datasheet | MC33SB0401ES Datasheet |
| In Stock | 322 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 6 V |
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Supply Voltage: | 20 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 48 |
| Package Equivalence Code: | LCC48(UNSPEC) |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | SMARTMOS |
| JESD-30 Code: | S-XQCC-N48 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVQCCN |
| Interface IC Type: | INTERFACE CIRCUIT |
| Moisture Sensitivity Level (MSL): | 3 |
