NXP Semiconductors - MC50XS4200BEKR2

MC50XS4200BEKR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC50XS4200BEKR2
Description BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet MC50XS4200BEKR2 Datasheet
In Stock641
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Output Current: 1.2 A
Sub-Category: Peripheral Drivers
Surface Mount: YES
Terminal Finish: Tin (Sn)
No. of Terminals: 32
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, SHRINK PITCH
JESD-30 Code: R-PDSO-G32
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: SSOP
Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Moisture Sensitivity Level (MSL): 3
Driver No. of Bits: 2
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: SSOP32,.4
Peak Reflow Temperature (C): 260
Terminal Pitch: .635 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 3.3/5,8/36
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Pricing (USD)

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