NXP Semiconductors - MC68EN360AI25L

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MC68EN360AI25L by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC68EN360AI25L
Description MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 240; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
In Stock17,776
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Time At Peak Reflow Temperature (s): 40
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
No. of Terminals: 240
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: S-PQFP-G240
Package Shape: SQUARE
Terminal Form: GULL WING
Peak Reflow Temperature (C): 260
Package Code: QFP
Moisture Sensitivity Level (MSL): 3
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