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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC68EN360CVR25L |
| Description | SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1.27 mm; |
| In Stock | 1,132 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.52 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| On Chip Data RAM Width: | 8 |
| No. of Terminals: | 357 |
| No. of Serial I/Os: | 1 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| No. of DMA Channels: | 16 |
| Address Bus Width: | 32 |
| Maximum Data Transfer Rate: | 1.25 MBps |
| Technology: | CMOS |
| RAM Words: | 2560 |
| JESD-30 Code: | S-PBGA-B357 |
| Maximum Clock Frequency: | 25 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Width: | 25 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Communication Protocol: | ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC |
| JESD-609 Code: | e1 |
| Package Equivalence Code: | BGA357,19X19,50 |
| Length: | 25 mm |
| Additional Features: | ALSO OPERATES AT 3.3 V |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | SCC, SMC, SPI, UART |
| Terminal Pitch: | 1.27 mm |
