NXP Semiconductors - MC68EN360CVR25L

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MC68EN360CVR25L by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC68EN360CVR25L
Description SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1.27 mm;
In Stock1,132
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.52 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
On Chip Data RAM Width: 8
No. of Terminals: 357
No. of Serial I/Os: 1
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of DMA Channels: 16
Address Bus Width: 32
Maximum Data Transfer Rate: 1.25 MBps
Technology: CMOS
RAM Words: 2560
JESD-30 Code: S-PBGA-B357
Maximum Clock Frequency: 25 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Communication Protocol: ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC
JESD-609 Code: e1
Package Equivalence Code: BGA357,19X19,50
Length: 25 mm
Additional Features: ALSO OPERATES AT 3.3 V
Peak Reflow Temperature (C): 260
Bus Compatibility: SCC, SMC, SPI, UART
Terminal Pitch: 1.27 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
1,132 $125.610 $142,190.520

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