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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC68EN360VR25VL |
| Description | SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | MC68EN360VR25VL Datasheet |
| In Stock | 47 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 4.75 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.86 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| Data Encoding or Decoding Method: | NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER) |
| On Chip Data RAM Width: | 8 |
| No. of Terminals: | 357 |
| No. of Serial I/Os: | 6 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| No. of DMA Channels: | 16 |
| Address Bus Width: | 32 |
| Maximum Data Transfer Rate: | 1.25 MBps |
| Technology: | HCMOS |
| RAM Words: | 2560 |
| JESD-30 Code: | S-PBGA-B357 |
| Maximum Clock Frequency: | 33.34 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 25 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
| Maximum Supply Voltage: | 5.25 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Communication Protocol: | ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA357,19X19,50 |
| Length: | 25 mm |
| Additional Features: | ALSO OPERATES AT 3.3 V |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | SCC, SMC, SPI, UART |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
