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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC68EN360VR33L |
Description | MICROCONTROLLER, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; |
In Stock | 3,807 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 4.75 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.86 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
ADC Channels: | NO |
No. of Terminals: | 357 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
No. of I/O Lines: | 46 |
Address Bus Width: | 32 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B357 |
Maximum Clock Frequency: | 6 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 25 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 33.34 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 5.25 V |
External Data Bus Width: | 32 |
Bit Size: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Length: | 25 mm |
PWM Channels: | NO |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL |