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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC68F375BGMZP33 |
Description | MICROCONTROLLER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: BGA; Package Shape: SQUARE; |
In Stock | 3,879 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
ADC Channels: | YES |
No. of Terminals: | 217 |
DMA Channels: | NO |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
No. of I/O Lines: | 48 |
Address Bus Width: | 24 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B217 |
Maximum Clock Frequency: | 33.6 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 33.6 rpm |
Peripheral IC Type: | MICROCONTROLLER |
Maximum Supply Voltage: | 3.6 V |
External Data Bus Width: | 16 |
Bit Size: | 32 |
DAC Channels: | YES |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
PWM Channels: | YES |
Peak Reflow Temperature (C): | 220 |
ROM Programmability: | FLASH |
Temperature Grade: | COMMERCIAL |