NXP Semiconductors - MC68F375BGMZP33

MC68F375BGMZP33 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC68F375BGMZP33
Description MICROCONTROLLER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: BGA; Package Shape: SQUARE;
In Stock3,879
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Surface Mount: YES
Terminal Finish: TIN LEAD
ADC Channels: YES
No. of Terminals: 217
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 48
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PBGA-B217
Maximum Clock Frequency: 33.6 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Speed: 33.6 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 16
Bit Size: 32
DAC Channels: YES
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
PWM Channels: YES
Peak Reflow Temperature (C): 220
ROM Programmability: FLASH
Temperature Grade: COMMERCIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
3,879 $22.420 $86,967.180

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