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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC68LC302CAF16CT |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; |
In Stock | 4,210 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Integrated Cache: | NO |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.7 mm |
Surface Mount: | YES |
Terminal Finish: | TIN |
On Chip Data RAM Width: | 8 |
No. of Terminals: | 100 |
No. of Serial I/Os: | 3 |
Terminal Position: | QUAD |
Format: | FIXED POINT |
Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
No. of DMA Channels: | 5 |
Address Bus Width: | 20 |
Technology: | CMOS |
RAM Words: | 1152 |
JESD-30 Code: | S-PQFP-G100 |
Maximum Clock Frequency: | 4 MHz |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LFQFP |
Width: | 14 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 16.67 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
No. of External Interrupts: | 3 |
Low Power Mode: | YES |
Boundary Scan: | NO |
External Data Bus Width: | 16 |
Bit Size: | 32 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | QFP100,.63SQ,20 |
Length: | 14 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |