NXP Semiconductors - MC8610TPX1066JB

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MC8610TPX1066JB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC8610TPX1066JB
Description Microprocessors; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;
In Stock2,649
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.7 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 783
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B783
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Speed: 1066 rpm
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Length: 29 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
2,649 $500.000 $1,324,500.000

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