NXP Semiconductors - MC8641DHX1500KE

MC8641DHX1500KE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC8641DHX1500KE
Description MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1023; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;
In Stock3,244
NAME DESCRIPTION
Minimum Supply Voltage: 1.05 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 1.1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.97 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 1023
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-CBGA-B1023
Maximum Clock Frequency: 1500 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 33 mm
Moisture Sensitivity Level (MSL): 3
Speed: 166.66 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.15 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e0
Qualification: Not Qualified
Package Equivalence Code: BGA1023,32X32,40
Length: 33 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
Power Supplies (V): 1.1,1.8/2.5,2.5/3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
3,244 $677.090 $2,196,479.960

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