MC9328MXLDVP15 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MC9328MXLDVP15
Description	SoC; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;
Datasheet	MC9328MXLDVP15 Datasheet
In Stock	1,501

NAME	DESCRIPTION
Minimum Supply Voltage:	1.7 V
Package Body Material:	PLASTIC/EPOXY
Peripheral IC Type:	SoC
Nominal Supply Voltage:	1.8 V
Maximum Supply Voltage:	1.9 V
Maximum Seated Height:	1.6 mm
Surface Mount:	YES
Minimum Operating Temperature:	-30 Cel
No. of Terminals:	225
Package Equivalence Code:	BGA225,15X15,32
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Length:	13 mm
Technology:	CMOS
JESD-30 Code:	S-PBGA-B225
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	LFBGA
Width:	13 mm
Terminal Pitch:	.8 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,501	$12.130	$18,207.130

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