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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC94MX21DVKN3 |
Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | MC94MX21DVKN3 Datasheet |
In Stock | 3,181 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.7 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.49 mm |
Surface Mount: | YES |
No. of Terminals: | 289 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Address Bus Width: | 26 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B289 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | LFBGA |
Width: | 14 mm |
Speed: | 350 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 3.3 V |
Low Power Mode: | NO |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Minimum Operating Temperature: | -30 Cel |
Length: | 14 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | OTHER |