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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC94MX21DVKN3 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | MC94MX21DVKN3 Datasheet |
| In Stock | 3,181 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.49 mm |
| Surface Mount: | YES |
| No. of Terminals: | 289 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B289 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LFBGA |
| Width: | 14 mm |
| Speed: | 350 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 3.3 V |
| Low Power Mode: | NO |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Minimum Operating Temperature: | -30 Cel |
| Length: | 14 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | OTHER |









