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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MC9S08PA4AVTGR |
Description | MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40; |
Datasheet | MC9S08PA4AVTGR Datasheet |
In Stock | 5,508 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2.7 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | NO |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Surface Mount: | YES |
On Chip Data RAM Width: | 8 |
Address Bus Width: | 0 |
Technology: | CMOS |
Maximum Clock Frequency: | 20 MHz |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Package Code: | TSSOP |
Moisture Sensitivity Level (MSL): | 3 |
Bit Size: | 8 |
DAC Channels: | NO |
Package Equivalence Code: | TSSOP16,.25 |
PWM Channels: | YES |
Connectivity: | SCI |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 8-Ch 12-Bit |
Terminal Pitch: | .65 mm |
CPU Family: | MC9S08 |
Nominal Supply Voltage: | 5 V |
Maximum Seated Height: | 1.2 mm |
Maximum Supply Current: | 120 mA |
Terminal Finish: | TIN |
ADC Channels: | YES |
No. of Terminals: | 16 |
No. of Timers: | 4 |
No. of Serial I/Os: | 1 |
DMA Channels: | NO |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
No. of I/O Lines: | 14 |
JESD-30 Code: | R-PDSO-G16 |
ROM Words: | 4096 |
Maximum Operating Temperature: | 105 Cel |
Width: | 4.4 mm |
Data EEPROM Size: | 128 |
Speed: | 20 rpm |
Peripheral IC Type: | MICROCONTROLLER |
Maximum Supply Voltage: | 5.5 V |
RAM Bytes: | 512 |
Low Power Mode: | YES |
Boundary Scan: | NO |
External Data Bus Width: | 0 |
Peripherals: | RTC, TIMER(4), WDT |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Length: | 5 mm |
On Chip Program ROM Width: | 8 |