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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCF54415CMJ250 |
| Description | MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
| In Stock | 1,086 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Sub-Category: | Microprocessors |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER |
| No. of Terminals: | 256 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Address Bus Width: | 0 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Maximum Clock Frequency: | 100 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 250 rpm |
| Peripheral IC Type: | MICROPROCESSOR |
| Maximum Supply Voltage: | 1.32 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 0 |
| Bit Size: | 32 |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA256,16X16,40 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.2,1.8,1.8/3.3,3.3 |









