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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX257CJM4AR2 |
| Description | MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; |
| In Stock | 421 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.38 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.45 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 400 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B400 |
| Maximum Clock Frequency: | 24 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 400 rpm |
| Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
| Maximum Supply Voltage: | 1.52 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 16 |
| Bit Size: | 32 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 17 mm |
| Additional Features: | ALSO REQUIRES 3.3 V I/O SUPPLY |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
