NXP Semiconductors - MCIMX31LCJKN5D

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MCIMX31LCJKN5D by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX31LCJKN5D
Description SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 457; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX31LCJKN5D Datasheet
In Stock1,225
NAME DESCRIPTION
Minimum Supply Voltage: 1.52 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.3 mm
Sub-Category: Microprocessors
Surface Mount: YES
No. of Terminals: 457
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B457
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 14 mm
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.65 V
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA457,26X26,20
Length: 14 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.2/1.5,1.8/3.3
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