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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MCIMX31LDVKN5DR2 |
Description | MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 457; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | MCIMX31LDVKN5DR2 Datasheet |
In Stock | 492 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -20 Cel |
No. of Terminals: | 457 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA457,26X26,20 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
JESD-30 Code: | S-PBGA-B457 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | FBGA |
Terminal Pitch: | .5 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 1.2/1.5,1.8/3.3 |
Moisture Sensitivity Level (MSL): | 3 |