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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX534AVP8C2 |
| Description | SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | MCIMX534AVP8C2 Datasheet |
| In Stock | 3,836 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.05 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC |
| Nominal Supply Voltage: | 1.1 V |
| Maximum Supply Voltage: | 1.15 V |
| Maximum Seated Height: | 1.85 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 529 |
| Package Equivalence Code: | BGA529,23X23,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Screening Level: | AEC-Q100 |
| Length: | 19 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B529 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | FBGA |
| Width: | 19 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | AUTOMOTIVE |
