NXP Semiconductors - MCIMX6D6AVT10ADR

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MCIMX6D6AVT10ADR by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6D6AVT10ADR
Description MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
Datasheet MCIMX6D6AVT10ADR Datasheet
In Stock856
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.16 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 624
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Other Names: 568-15211-2
568-15211-1
MCIMX6D6AVT10ADR-ND
935315187518
568-15211-6
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Low Power Mode: NO
Boundary Scan: YES
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 21 mm
Additional Features: 64-BIT BUS WIDTH AVAILABLE
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
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Pricing (USD)

Qty. Unit Price Ext. Price
856 $60.276 $51,596.256

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