NXP Semiconductors - MCIMX6L2EVN10AB

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MCIMX6L2EVN10AB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6L2EVN10AB
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 576; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet MCIMX6L2EVN10AB Datasheet
In Stock2,542
NAME DESCRIPTION
Minimum Supply Voltage: 1.375 V
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.1 mm
Surface Mount: YES
Maximum Supply Current: 1100 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 576
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
No. of I/O Lines: 162
Address Bus Width: 16
Technology: CMOS
RAM Words: 16384
JESD-30 Code: S-PBGA-B
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: TFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.5 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA432,24X24,20
Length: 13 mm
Peak Reflow Temperature (C): 260
Bus Compatibility: CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
2,542 $19.690 $50,051.980

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