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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MCIMX6Q5EYM10ACR |
Description | MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 16; |
In Stock | 227 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.35 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.4 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.6 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 624 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 16 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B624 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | HBGA |
Width: | 21 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 1000 rpm |
Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
Maximum Supply Voltage: | 1.5 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
JESD-609 Code: | e1 |
Length: | 21 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |