Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX6Q5EYM10ACR |
| Description | MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 16; |
| In Stock | 227 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.35 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.4 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 624 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Address Bus Width: | 16 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B624 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | HBGA |
| Width: | 21 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 1000 rpm |
| Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
| Maximum Supply Voltage: | 1.5 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 64 |
| JESD-609 Code: | e1 |
| Length: | 21 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
