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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX6Q5EYM10CC |
| Description | MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Length: 21 mm; |
| In Stock | 865 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.35 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.4 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| No. of Terminals: | 624 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B624 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | HBGA |
| Width: | 21 mm |
| Speed: | 1000 rpm |
| Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
| Maximum Supply Voltage: | 1.5 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Length: | 21 mm |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .8 mm |









