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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MCIMX6Q6AVT10AER |
Description | SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | MCIMX6Q6AVT10AER Datasheet |
In Stock | 828 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.35 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.4 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.16 mm |
Surface Mount: | YES |
No. of Terminals: | 624 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B624 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | FBGA |
Width: | 21 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | SoC |
Maximum Supply Voltage: | 1.5 V |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA624,25X25,32 |
Length: | 21 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Temperature Grade: | AUTOMOTIVE |