NXP Semiconductors - MCIMX6S5EVM10ADR

MCIMX6S5EVM10ADR by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6S5EVM10ADR
Description SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
Datasheet MCIMX6S5EVM10ADR Datasheet
In Stock4,505
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 624
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.5 V
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
Package Equivalence Code: BGA624,25X25,32
Length: 21 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
4,505 $43.720 $196,958.600

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