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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MCIMX6X2EVN10ABR |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS; |
Datasheet | MCIMX6X2EVN10ABR Datasheet |
In Stock | 88 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Speed: | 800 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.27 mm |
Surface Mount: | YES |
Bit Size: | 32 |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 400 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Length: | 17 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B400 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 260 |
Package Code: | LFBGA |
Width: | 17 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 3 |