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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX6X2EVN10ABR |
| Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS; |
| Datasheet | MCIMX6X2EVN10ABR Datasheet |
| In Stock | 7,508 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
568-15225-1 935320463518 568-15225-6 MCIMX6X2EVN10ABR-ND 568-15225-2 |
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 800 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.27 mm |
| Surface Mount: | YES |
| Bit Size: | 32 |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| No. of Terminals: | 400 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 17 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B400 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | LFBGA |
| Width: | 17 mm |
| Terminal Pitch: | .8 mm |
| Moisture Sensitivity Level (MSL): | 3 |









