NXP Semiconductors - MCIMX7S5EVM08SC

MCIMX7S5EVM08SC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX7S5EVM08SC
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX7S5EVM08SC Datasheet
In Stock1,108
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.42 mm
Surface Mount: YES
No. of Terminals: 541
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B541
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Speed: 800 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.155 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: -20 Cel
Length: 19 mm
Additional Features: SEATED-HGT CALCULATED
Peak Reflow Temperature (C): 260
Terminal Pitch: .75 mm
Temperature Grade: OTHER
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