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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MCM36F8DG10 |
Description | SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: BICMOS; |
Datasheet | MCM36F8DG10 Datasheet |
In Stock | 1,821 |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Organization: | 256KX36 |
Maximum Seated Height: | 25.55 mm |
Minimum Supply Voltage (Vsup): | 3.135 V |
Surface Mount: | NO |
No. of Terminals: | 144 |
No. of Words: | 262144 words |
Terminal Position: | ZIG-ZAG |
Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
Technology: | BICMOS |
JESD-30 Code: | R-XZMA-N144 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIMM |
Width: | 3.8 mm |
Memory Density: | 9437184 bit |
Memory IC Type: | SRAM MODULE |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 36 |
No. of Functions: | 1 |
Length: | 67.6 mm |
Maximum Access Time: | 10 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Additional Features: | WD-MAX |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |