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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCM36F8DG10 |
| Description | SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: BICMOS; |
| Datasheet | MCM36F8DG10 Datasheet |
| In Stock | 1,821 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Organization: | 256KX36 |
| Maximum Seated Height: | 25.55 mm |
| Minimum Supply Voltage (Vsup): | 3.135 V |
| Surface Mount: | NO |
| No. of Terminals: | 144 |
| No. of Words: | 262144 words |
| Terminal Position: | ZIG-ZAG |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Technology: | BICMOS |
| JESD-30 Code: | R-XZMA-N144 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIMM |
| Width: | 3.8 mm |
| Memory Density: | 9437184 bit |
| Memory IC Type: | SRAM MODULE |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 36 |
| No. of Functions: | 1 |
| Length: | 67.6 mm |
| Maximum Access Time: | 10 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | WD-MAX |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
