NXP Semiconductors - MCM36F8DG10

MCM36F8DG10 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM36F8DG10
Description SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: BICMOS;
Datasheet MCM36F8DG10 Datasheet
In Stock1,821
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Organization: 256KX36
Maximum Seated Height: 25.55 mm
Minimum Supply Voltage (Vsup): 3.135 V
Surface Mount: NO
No. of Terminals: 144
No. of Words: 262144 words
Terminal Position: ZIG-ZAG
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: BICMOS
JESD-30 Code: R-XZMA-N144
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: DIMM
Width: 3.8 mm
Memory Density: 9437184 bit
Memory IC Type: SRAM MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Length: 67.6 mm
Maximum Access Time: 10 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: WD-MAX
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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