MCM36F9DG10 by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCM36F9DG10
Description	SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Shape: RECTANGULAR; Organization: 512KX36; JESD-30 Code: R-XDMA-N144;
Datasheet	MCM36F9DG10 Datasheet
In Stock	3,335

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Organization:	512KX36
Minimum Supply Voltage (Vsup):	3.135 V
Surface Mount:	NO
No. of Terminals:	144
No. of Words:	524288 words
Terminal Position:	DUAL
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	BICMOS
JESD-30 Code:	R-XDMA-N144
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Memory Density:	18874368 bit
Memory IC Type:	SRAM MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	36
No. of Functions:	1
Qualification:	Not Qualified
Maximum Access Time:	10 ns
No. of Words Code:	512K
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	FLOW-THROUGH ARCHITECTURE
Parallel or Serial:	PARALLEL
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,335	-	-

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