NXP Semiconductors - MCM63D736TQ133

MCM63D736TQ133 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM63D736TQ133
Description MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Length: 24 mm;
Datasheet MCM63D736TQ133 Datasheet
In Stock1,015
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128KX36
Maximum Seated Height: 1.6 mm
Minimum Supply Voltage (Vsup): 3.135 V
Surface Mount: YES
No. of Terminals: 176
No. of Words: 131072 words
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PQFP-G176
Package Shape: SQUARE
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LFQFP
Width: 24 mm
Memory Density: 4718592 bit
Memory IC Type: MULTI-PORT SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Length: 24 mm
Maximum Access Time: 4 ns
No. of Words Code: 128K
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.465 V
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