NXP Semiconductors - MCM63F819ZP10R

MCM63F819ZP10R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM63F819ZP10R
Description CACHE SRAM; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Seated Height: 2.4 mm; Maximum Supply Voltage (Vsup): 3.6 V;
Datasheet MCM63F819ZP10R Datasheet
In Stock1,173
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .005 Amp
Organization: 256KX18
Maximum Seated Height: 2.4 mm
Minimum Supply Voltage (Vsup): 3.135 V
Surface Mount: YES
Maximum Supply Current: 285 mA
No. of Terminals: 119
Maximum Clock Frequency (fCLK): 66 MHz
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
Input/Output Type: COMMON
No. of Ports: 1
Memory Density: 4718592 bit
Minimum Standby Voltage: 3.125 V
Memory IC Type: CACHE SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 18
Output Enable: YES
No. of Functions: 1
Package Equivalence Code: BGA119,7X17,50
Length: 22 mm
Maximum Access Time: 10 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: FLOW THROUGH ARCHITECTURE
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Maximum Supply Voltage (Vsup): 3.6 V
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