
Image shown is a representation only.
Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MCM63F819ZP10R |
Description | CACHE SRAM; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Seated Height: 2.4 mm; Maximum Supply Voltage (Vsup): 3.6 V; |
Datasheet | MCM63F819ZP10R Datasheet |
In Stock | 1,173 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .005 Amp |
Organization: | 256KX18 |
Maximum Seated Height: | 2.4 mm |
Minimum Supply Voltage (Vsup): | 3.135 V |
Surface Mount: | YES |
Maximum Supply Current: | 285 mA |
No. of Terminals: | 119 |
Maximum Clock Frequency (fCLK): | 66 MHz |
No. of Words: | 262144 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B119 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 14 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 4718592 bit |
Minimum Standby Voltage: | 3.125 V |
Memory IC Type: | CACHE SRAM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 18 |
Output Enable: | YES |
No. of Functions: | 1 |
Package Equivalence Code: | BGA119,7X17,50 |
Length: | 22 mm |
Maximum Access Time: | 10 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Additional Features: | FLOW THROUGH ARCHITECTURE |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1.27 mm |
Maximum Supply Voltage (Vsup): | 3.6 V |