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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCM63R736FC3.7 |
| Description | LATE-WRITE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; |
| Datasheet | MCM63R736FC3.7 Datasheet |
| In Stock | 356 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 128KX36 |
| Maximum Seated Height: | 2.77 mm |
| Minimum Supply Voltage (Vsup): | 2.375 V |
| Surface Mount: | YES |
| No. of Terminals: | 119 |
| No. of Words: | 131072 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B119 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 14 mm |
| Memory Density: | 4718592 bit |
| Memory IC Type: | LATE-WRITE SRAM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 36 |
| No. of Functions: | 1 |
| Length: | 22 mm |
| Maximum Access Time: | 1.85 ns |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
