MCM63R836FC4.0R by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCM63R836FC4.0R
Description	LATE-WRITE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA119,7X17,50;
Datasheet	MCM63R836FC4.0R Datasheet
In Stock	3,063

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.175 Amp
Organization:	256KX36
Output Characteristics:	3-STATE
Maximum Seated Height:	2.77 mm
Minimum Supply Voltage (Vsup):	2.375 V
Surface Mount:	YES
Maximum Supply Current:	500 mA
No. of Terminals:	119
No. of Words:	262144 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B119
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	14 mm
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	9437184 bit
Minimum Standby Voltage:	2.375 V
Memory IC Type:	LATE-WRITE SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	36
Output Enable:	YES
No. of Functions:	1
Package Equivalence Code:	BGA119,7X17,50
Length:	22 mm
Maximum Access Time:	4 ns
No. of Words Code:	256K
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,063	-	-

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