NXP Semiconductors - MCM63Z834ZP11R

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MCM63Z834ZP11R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM63Z834ZP11R
Description ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Additional Features: FLOW-THROUGH OR PIPELINED ARCHTECTURE;
Datasheet MCM63Z834ZP11R Datasheet
In Stock71
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256KX36
Output Characteristics: 3-STATE
Maximum Seated Height: 2.4 mm
Minimum Supply Voltage (Vsup): 3.135 V
Sub-Category: SRAMs
Surface Mount: YES
No. of Terminals: 119
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
Input/Output Type: COMMON
Memory Density: 9437184 bit
Minimum Standby Voltage: 3.14 V
Memory IC Type: ZBT SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA119,7X17,50
Length: 22 mm
Maximum Access Time: 11 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: FLOW-THROUGH OR PIPELINED ARCHTECTURE
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.465 V
Power Supplies (V): 2.5/3.3,3.3
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