MCM64E918FC4.0 by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCM64E918FC4.0
Description	DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Width: 14 mm;
Datasheet	MCM64E918FC4.0 Datasheet
In Stock	2,814

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	512KX18
Maximum Seated Height:	2.77 mm
Minimum Supply Voltage (Vsup):	2.375 V
Surface Mount:	YES
No. of Terminals:	153
No. of Words:	524288 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	14 mm
Memory Density:	9437184 bit
Memory IC Type:	DDR SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	18
No. of Functions:	1
Length:	22 mm
No. of Words Code:	512K
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	2.625 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,814	-	-

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