MCM67Q709AZP10 by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCM67Q709AZP10
Description	STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 86; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
Datasheet	MCM67Q709AZP10 Datasheet
In Stock	2,905

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	128KX9
Maximum Seated Height:	2.44 mm
Minimum Supply Voltage (Vsup):	4.75 V
Surface Mount:	YES
No. of Terminals:	86
No. of Words:	131072 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B86
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	16.26 mm
Memory Density:	1179648 bit
Memory IC Type:	STANDARD SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	9
No. of Functions:	1
Length:	17.78 mm
Maximum Access Time:	5 ns
No. of Words Code:	128K
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.524 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	5.25 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,905	-	-

RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

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N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;