NXP Semiconductors - MCM69F737ZP8.5

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MCM69F737ZP8.5 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM69F737ZP8.5
Description CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Length: 22 mm;
Datasheet MCM69F737ZP8.5 Datasheet
In Stock262
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128KX36
Output Characteristics: 3-STATE
Maximum Seated Height: 2.4 mm
Minimum Supply Voltage (Vsup): 3.135 V
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 119
No. of Words: 131072 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
No. of Ports: 1
Memory Density: 4718592 bit
Memory IC Type: CACHE SRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 36
Output Enable: YES
No. of Functions: 1
Qualification: Not Qualified
Length: 22 mm
Maximum Access Time: 8.5 ns
No. of Words Code: 128K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: OPTIONAL INTERLEAVED OR LINEAR BURST; BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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