MCM69P737ZP3.8R by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCM69P737ZP3.8R
Description	CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Standby Voltage: 3.14 V;
Datasheet	MCM69P737ZP3.8R Datasheet
In Stock	3,662

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.045 Amp
Organization:	128KX36
Output Characteristics:	3-STATE
Maximum Seated Height:	2.4 mm
Minimum Supply Voltage (Vsup):	3.135 V
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	400 mA
No. of Terminals:	119
No. of Words:	131072 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B119
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	14 mm
Input/Output Type:	COMMON
Memory Density:	4718592 bit
Minimum Standby Voltage:	3.14 V
Memory IC Type:	CACHE SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	36
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA119,7X17,50
Length:	22 mm
Maximum Access Time:	3.8 ns
No. of Words Code:	128K
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	PIPELINED ARCHITECTURE
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	2.5/3.3,3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,662	-	-

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