Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCM69P819ZP3.8R |
| Description | CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Additional Features: LINEAR/INTERLEAVED BURST SEQUENCE; INTERNALLY SELF-TIMED WRITE CYCLE; BYTE/GLOBAL WRITE CONTROL; |
| Datasheet | MCM69P819ZP3.8R Datasheet |
| In Stock | 3,165 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256KX18 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | 2.4 mm |
| Minimum Supply Voltage (Vsup): | 3.135 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 119 |
| No. of Words: | 262144 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | MOS |
| JESD-30 Code: | R-PBGA-B119 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 14 mm |
| No. of Ports: | 1 |
| Memory Density: | 4718592 bit |
| Memory IC Type: | CACHE SRAM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| Output Enable: | YES |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 22 mm |
| Maximum Access Time: | 3.8 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | LINEAR/INTERLEAVED BURST SEQUENCE; INTERNALLY SELF-TIMED WRITE CYCLE; BYTE/GLOBAL WRITE CONTROL |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
