NXP Semiconductors - MCM69R737AZP6

MCM69R737AZP6 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM69R737AZP6
Description LATE-WRITE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Datasheet MCM69R737AZP6 Datasheet
In Stock2,045
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128KX36
Maximum Seated Height: 2.4 mm
Minimum Supply Voltage (Vsup): 3.15 V
Surface Mount: YES
No. of Terminals: 119
No. of Words: 131072 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: BICMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
Memory Density: 4718592 bit
Memory IC Type: LATE-WRITE SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Length: 22 mm
Maximum Access Time: 3 ns
No. of Words Code: 128K
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

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