NXP Semiconductors - MCM69R738AZP5R

MCM69R738AZP5R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM69R738AZP5R
Description LATE-WRITE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 36;
In Stock4,451
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .05 Amp
Organization: 128KX36
Output Characteristics: 3-STATE
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 550 mA
No. of Terminals: 119
No. of Words: 131072 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: BICMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Input/Output Type: COMMON
Memory Density: 4718592 bit
Minimum Standby Voltage: 3.15 V
Memory IC Type: LATE-WRITE SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 36
Qualification: Not Qualified
Package Equivalence Code: BGA119,7X17,50
Maximum Access Time: 2.5 ns
No. of Words Code: 128K
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 2.5,3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
4,451 - -

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