Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCM69R818AZP8R |
| Description | LATE-WRITE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; |
| In Stock | 1,714 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256KX18 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 450 mA |
| No. of Terminals: | 119 |
| No. of Words: | 262144 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | BICMOS |
| JESD-30 Code: | R-PBGA-B119 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Input/Output Type: | COMMON |
| Memory Density: | 4718592 bit |
| Minimum Standby Voltage: | 3.15 V |
| Memory IC Type: | LATE-WRITE SRAM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA119,7X17,50 |
| Maximum Access Time: | 4 ns |
| No. of Words Code: | 256K |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.5,3.3 |
