NXP Semiconductors - MCZ33811EGR2

MCZ33811EGR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCZ33811EGR2
Description INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
In Stock946
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Driver No. of Bits: 5
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Peripheral Drivers
Surface Mount: YES
Terminal Finish: Matte Tin (Sn)
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Terminals: 16
Qualification: Not Qualified
Package Equivalence Code: SOP16,.4
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 260
Package Code: SOP
Interface IC Type: INTERFACE CIRCUIT
Terminal Pitch: 1.27 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 5,7/17
Moisture Sensitivity Level (MSL): 3
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