NXP Semiconductors - MCZ33903BS3EKR2

MCZ33903BS3EKR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCZ33903BS3EKR2
Description POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet MCZ33903BS3EKR2 Datasheet
In Stock1,386
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Width (mm): 7.5 mm
Maximum Seated Height: 2.45 mm
Minimum Supply Voltage (Vsup): 5.5 V
Surface Mount: YES
No. of Terminals: 32
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Technology: MOS
JESD-30 Code: R-PDSO-G32
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
No. of Channels: 1
Package Code: HSSOP
Nominal Supply Voltage (Vsup): 10.5 V
Moisture Sensitivity Level (MSL): 3
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT
Length: 11 mm
Adjustable Threshold: YES
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 28 V
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