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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MF3MOD2101DA8/05 |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: X-PXMA-N; |
| Datasheet | MF3MOD2101DA8/05 Datasheet |
| In Stock | 3,678 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Technology: | CMOS |
| JESD-30 Code: | X-PXMA-N |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -25 Cel |
| Temperature Grade: | OTHER |









