Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MIMX8MM1CVTKZAA |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | MIMX8MM1CVTKZAA Datasheet |
| In Stock | 246 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .9 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | .95 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.25 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER |
| No. of Terminals: | 486 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B486 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | LFBGA |
| Width: | 14 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: | 935378339557 |
| Peripheral IC Type: | SoC |
| Maximum Supply Voltage: | 1 V |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA486,27X27,20 |
| Length: | 14 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |









