NXP Semiconductors - MIMX8MN5DVPIZAA

MIMX8MN5DVPIZAA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MIMX8MN5DVPIZAA
Description SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet MIMX8MN5DVPIZAA Datasheet
In Stock893
NAME DESCRIPTION
Minimum Supply Voltage: .9 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .95 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.01 mm
Surface Mount: YES
No. of Terminals: 306
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B306
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 95 Cel
Package Code: TFBGA
Width: 11 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1 V
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA306,21X21,20
Length: 11 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
893 - -

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