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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MIMX8MN5DVPIZAA |
Description | SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | MIMX8MN5DVPIZAA Datasheet |
In Stock | 893 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .9 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .95 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.01 mm |
Surface Mount: | YES |
No. of Terminals: | 306 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B306 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 95 Cel |
Package Code: | TFBGA |
Width: | 11 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | SoC |
Maximum Supply Voltage: | 1 V |
Minimum Operating Temperature: | 0 Cel |
Package Equivalence Code: | BGA306,21X21,20 |
Length: | 11 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |