NXP Semiconductors - MIMX8QP5AVUFFAB

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MIMX8QP5AVUFFAB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MIMX8QP5AVUFFAB
Description MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 1313; Package Code: FBGA; Package Shape: SQUARE;
Datasheet MIMX8QP5AVUFFAB Datasheet
In Stock27
NAME DESCRIPTION
Minimum Supply Voltage: 1.05 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.52 mm
Surface Mount: YES
Maximum Supply Current: 5000 mA
No. of Terminals: 1313
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
No. of I/O Lines: 1
Address Bus Width: 0
Technology: CMOS
RAM Words: 524288
JESD-30 Code: S-PBGA-B1313
Maximum Clock Frequency: 24 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MULTIFUNCTION PERIPHERAL
Maximum Supply Voltage: 1.15 V
Boundary Scan: YES
External Data Bus Width: 0
Minimum Operating Temperature: -40 Cel
Length: 29 mm
Additional Features: lsio contains 8 GPIO lines
Peak Reflow Temperature (C): 260
Bus Compatibility: CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB
Terminal Pitch: .75 mm
Temperature Grade: AUTOMOTIVE
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