NXP Semiconductors - MIMX9332XVUXMAA

  1. Home
  2. NXP Semiconductors - MIMX9332XVUXMAA
MIMX9332XVUXMAA by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MIMX9332XVUXMAA
Description SoC;
Datasheet MIMX9332XVUXMAA Datasheet
In Stock268
NAME DESCRIPTION
Peripheral IC Type: SoC
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
268 - -

Popular Products

Category Top Products

SCANSTA112SMX/NOPB by Texas Instruments

SCANSTA112SMX/NOPB

Texas Instruments

SCANSTA112SMX/NOPB by Texas Instruments is a 100-terminal microprocessor circuit with CMOS technology. It operates at a supply voltage range of 3V to 3.6V and has an industrial temperature grade of -40°C to 85°C. This square-shaped IC is ideal for applications requiring low-profile, fine-pitch grid array packages in surface-mount configurations.
XCZU2CG-1SBVA484I by Xilinx

XCZU2CG-1SBVA484I

Xilinx

XCZU2CG-1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.
XCZU4EV-1FBVB900I by Xilinx

XCZU4EV-1FBVB900I

Xilinx

XCZU4EV-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it requires a supply voltage of 0.825V to 0.876V.
CLRC66301HN,151 by NXP Semiconductors

CLRC66301HN,151

NXP Semiconductors

Other uPs/uCs/Peripheral ICs;
DS2408S by Dallas Semiconductor

DS2408S

Dallas Semiconductor

Other uPs/uCs/Peripheral ICs;
FT245RQ by FTDI

FT245RQ

FTDI

FT245RQ by FTDI is a 32-terminal peripheral IC with USB bus compatibility. It operates at 3.3-5.25V, -40 to 85°C, and supports an 8-bit external data bus width with a clock frequency of up to 12.02MHz. Ideal for industrial applications requiring microprocessor circuits in compact square chip carrier packages.
ESP32-C3 by Espressif Systems (Shanghai)

ESP32-C3

Espressif Systems (Shanghai)

ESP32-C3 by Espressif Systems is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact square package and surface mount capability.
AS5140H-ASSM by Ams Ag

AS5140H-ASSM

Ams Ag

SYSTEM ON CHIP; Terminal Finish: TIN; JESD-609 Code: e3;
XCZU7EV-L2FBVB900E by Xilinx

XCZU7EV-L2FBVB900E

Xilinx

The Xilinx XCZU7EV-L2FBVB900E is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0-110°C, with supply voltage ranging from 0.698-0.742 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.
CY8C6137BZI-F34 by Infineon Technologies

CY8C6137BZI-F34

Infineon Technologies

CY8C6137BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a grid array package style, it's ideal for applications requiring fine pitch and thin profile designs.
CY8C3866AXI-039 by Infineon Technologies

CY8C3866AXI-039

Infineon Technologies

CY8C3866AXI-039 by Infineon: 100-terminal IC with 3.3V supply, 65536 ROM bits, and CMOS technology. Ideal for industrial applications requiring a programmable SoC in a compact, low-profile package. Operates b/w -40 to 85 °C with peak reflow temp of 260 C.
163PC01D36 by Honeywell Sensing And Control

163PC01D36

Honeywell Sensing And Control

Other uPs/uCs/Peripheral ICs;
ESP32-S3-WROOM-1U-N16R2 by Espressif Systems (Shanghai)

ESP32-S3-WROOM-1U-N16R2

Espressif Systems (Shanghai)

ESP32-S3-WROOM-1U-N16R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.
XC7Z035-1FBG676I by Xilinx

XC7Z035-1FBG676I

Xilinx

XC7Z035-1FBG676I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact spaces.
AM5718AABCX by Texas Instruments

AM5718AABCX

Texas Instruments

AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.
EFR32BG22C112F352GM32-C by Silicon Labs

EFR32BG22C112F352GM32-C

Silicon Labs

SoC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2;
XC7Z020-3CLG400E by Xilinx

XC7Z020-3CLG400E

Xilinx

The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
MCIMX6U7CVM08AC by NXP Semiconductors

MCIMX6U7CVM08AC

NXP Semiconductors

MCIMX6U7CVM08AC by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105 °C. It features a low profile grid array package style and uses CMOS technology. Ideal for industrial applications requiring high performance in compact form factor.
XC7Z007S-1CLG225I by Xilinx

XC7Z007S-1CLG225I

Xilinx

XC7Z007S-1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various embedded applications.
A2F200M3F-CSG288I by Microchip Technology

A2F200M3F-CSG288I

Microchip Technology

Microchip A2F200M3F-CSG288I is a 288-terminal SoC FPGA with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 1.425-1.575 V. Ideal for applications requiring thin profile and fine pitch grid array packages.